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  • 产品与市场

    S7045G

    特点

    ● 高Tg>170℃ (DSC),无卤材料
    ● 低插损,Dk/Df (@10GHz, IPC-TM-650 2.5.5.5): 3.98/0.0145
    ● 更低的Z轴热膨胀系数,优异的通孔加工性

    ● 优异的耐CAF性能

    ● 使用RTF铜箔能获得更低的信号损耗

    应用领域

    ● 服务器、交换机、路由器、基站、背板和线卡
    • 产品性能
    • 产品证书
    • 资料下载
    Items Method Condition Unit Typical Value
    Tg IPC-TM-650 2.4.25 DSC 170
    Tg IPC-TM-650 2.4.24.4
    DMA
    190
    Td IPC-TM-650 2.4.24.6 5% wt. loss 390
    CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 40
    After Tg ppm/℃ 210
    50-260℃ % 2.3
    T260 IPC-TM-650 2.4.24.1 TMA min >60
    T288 IPC-TM-650 2.4.24.1 TMA min >60
    Thermal Stress
    IPC-TM-650 2.4.13.1
    288℃, solder dip
    -- PASS
    Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1GHz -- 4.40
    IPC-TM-650 2.5.5.5
    10GHz
    -- 3.98
    IEC 61189-2-721
    10GHz -- 4.42
    Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1GHz -- 0.0100
    IPC-TM-650 2.5.5.5
    10GHz
    -- 0.0145
    IEC 61189-2-721
    10GHz -- 0.0150
    Peel Strength (1oz RTF copper foil) IPC-TM-650 2.4.8 A N/mm
    After thermal Stress 288℃,10s N/mm 1.4
    125℃ N/mm
    Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.12
    Flammability UL94 C-48/23/50 Rating V-0
    E-24/125 Rating V-0

    Remarks:

    1. All the typical value is based on 0.76mm (6*2116) thickness specimen, but not guarantee data.

    2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

    Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

    The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.